Samsung LPDDR5 UFS multi-chip package starts mass production: Enter the domestic market this month-Samsung, memory, LPDDR5 —
According to news on June 16, this morning, China's Samsung officially announced via Weibo that starting this month, Samsung's first LPDDR5 uMCP will be mass-produced and used in mid-to-high-end smartphones. Officials said that at present, Samsung has successfully completed the compatibility test of LPDDR5 uMCP with several global smartphone manufacturers, and it is expected that from this month, smartphones equipped with the new LPDDR5 uMCP will enter the Chinese market. It is understood that, based on UFS multi-chip packaged LPDDR5, Samsung uMCP integrates the fastest LPDDR5 DRAM and the latest UFS 3.1 NAND flash memory among Samsung products compared with the previous generation products, which can be described as more smartphone users providing flagship performance. Zheng Guangxi, General Manager of Samsung Semiconductor Storage Market Department, said: “Samsung’s latest LPDDR5 uMCP is based on advanced memory and packaging technology, allowing consumers to enjoy a seamless streaming, gaming and mixed reality experience even on low-end devices.” Samsung's latest mobile DRAM and NAND interfaces, compared to previous generation products, Samsung uMCP can provide extremely fast speed and large storage capacity with extremely low power consumption. It is worth mentioning that this product portfolio allows many functions that were previously only available on high-end flagship models, such as high-end photography, graphics-intensive games and augmented reality, to be used on mid-range devices. According to reports, compared with the previous UFS 2.2 solution based on LPDDR4X, the DRAM performance of the new uMCP is improved by more than 50%, from 17GB/s to 25GB/s. Not only that, the performance of NAND flash memory has also been significantly improved, from the original 1.5GB/s to 3GB/s, thus creating a flagship performance.