Motherboard Disassemble Platform Main Unit For Mobile Phone - SS-T12A
Specifications
● Model: SS-T12A
● Main machine size: 124*90*40mm (L*W*H)
● Input: AC110-230V, 50/60Hz, 5A
● Net weight: 375 g
● Rated Power: 70W
● Temperature: 100-280℃
Features
● Accurate temperature control and temperature adjustable
● Offers heat evenly to protect the motherboard from damage
● Adopting 185 degrees layered process to remove the mobile phone's motherboard.
solder paste, but it depends on the special heating design and precise temperature control of SS-T12A.
● SS-T12A motherboard separate platform only heats the area that the mobile phone's board needs to be removed to prevent improper heating.
● Dual bayonet design, make sure the mobile phone's motherboard is stable on the stage.
● High purity copper is used as a film to ensure uniform heat transfer and heat.
