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Motherboard Disassemble Platform Main Unit For Mobile Phone - SS-T12A

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Motherboard Disassemble Platform Main Unit For Mobile Phone - SS-T12A
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MOQ:
1PCS
Payment:
TT/Money Gram/WU/Paypal
Place of Origin:
ShenZhen
Brand;
YOUKING
Delivery Time:
1-3 Days
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Product Description

The motherboard disassemble platform main unit for mobile phone - SS-T12A is a double layers board pre-heating rework station, it is used for quick desolder&resolder for mobile phone double-layer logic board. It is matched with the Motherboard Disassemble Platform Heating Groove

Motherboard Disassemble Platform Main Unit For Mobile Phone - SS-T12A

Specifications

● Model: SS-T12A

● Main machine size: 124*90*40mm (L*W*H)

● Input: AC110-230V, 50/60Hz, 5A

● Net weight: 375 g

● Rated Power: 70W

● Temperature: 100-280℃

Features

● Accurate temperature control and temperature adjustable

● Offers heat evenly to protect the motherboard from damage

● Adopting 185 degrees layered process to remove the mobile phone's motherboard.

solder paste, but it depends on the special heating design and precise temperature control of SS-T12A.

● SS-T12A motherboard separate platform only heats the area that the mobile phone's board needs to be removed to prevent improper heating.

● Dual bayonet design, make sure the mobile phone's motherboard is stable on the stage.

● High purity copper is used as a film to ensure uniform heat transfer and heat.

After-Sale Service

Please feel free to contact us for any problems at any time: sales@youkingtech.com

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