Motherboard Disassemble Platform Heating Groove For Mobile

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Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - FACE

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MOQ:: 1PCS

Payment:: TT/Money Gram/WU/Paypal

Place of Origin:: ShenZhen

Brand;: YOUKING

Delivery Time:: 1-3 Days

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Product Description

The motherboard disassembles platform heating groove for mobile phone - T12A - FACE is based on the T12A's advanced structural design and is specifically designed to repair face ID cables, And risk-free replacement of the distance sensor. It is matched with the Motherboard Disassemble Platform Main Unit - SS-T12A

Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - FACE

Specifications

● Model: T12A - FACE

● Motherboard heating groove size: 126*72*18 mm (L*W*H)

● Temperature: 100-280℃

Features

● The motherboard disassembles platform heating groove for mobile phone - T12A - FACE including distance sensing module, Lattice module, Heating

area (high purify capper film), Silicone insulation, Infrared camera.

● Easy to fix the flex. Set the heating temperature at 195 degrees. Set heating time to 2 minutes. Flexible crimping, the infrared head is fixed by the groove

After-Sale Service

Please feel free to contact us for any problems at any time: sales@youkingtech.com