Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - FACE
● Model: T12A - FACE
● Motherboard heating groove size: 126*72*18 mm (L*W*H)
● Temperature: 100-280℃
● The motherboard disassembles platform heating groove for mobile phone - T12A - FACE including distance sensing module, Lattice module, Heating
area (high purify capper film), Silicone insulation, Infrared camera.
● Easy to fix the flex. Set the heating temperature at 195 degrees. Set heating time to 2 minutes. Flexible crimping, the infrared head is fixed by the groove