Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - F
● Model: T12A - F
● motherboard heating groove size: 126*72*18 mm (L*W*H)
● Net weight: 363 g
● Temperature: 100-280℃
● Accurate temperature control and temperature adjustable.
● Offers heat evenly to protect the motherboard from damage.
● High purity copper is used as a film to ensure uniform heat transfer and heat.