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Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - F

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Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - F
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MOQ:
1PCS
Payment:
TT/Money Gram/WU/Paypal
Place of Origin:
ShenZhen
Brand;
YOUKING
Delivery Time:
1-3 Days
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Product Description

The motherboard disassemble platform heating groove for mobile phone - T12A - F including heating area, Fingerprint repair heating slot, IC slot, Universal heating slot, Silicone insulation, High purity copper film, Screen bracket in addition to glue. It is used to bracket heating degumming, IC heating degumming, Universal heating and removing glue, Fingerprint repair, and glue removal. It is matched with the Motherboard Disassemble Platform Main Unit - SS-T12A

Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - F

Specifications

● Model: T12A - F

● motherboard heating groove size: 126*72*18 mm (L*W*H)

● Net weight: 363 g

● Temperature: 100-280℃

Features

● Accurate temperature control and temperature adjustable.

● Offers heat evenly to protect the motherboard from damage.

● High purity copper is used as a film to ensure uniform heat transfer and heat.

After-Sale Service

Please feel free to contact us for any problems at any time: sales@youkingtech.com

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