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Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - CPU

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Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - CPU
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MOQ:
1PCS
Payment:
TT/Money Gram/WU/Paypal
Place of Origin:
ShenZhen
Brand;
YOUKING
Delivery Time:
1-3 Days
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Product Description

The motherboard disassemble platform heating groove for mobile phone - T12A - CPU including heating area, Silicone insulation, High purity copper film. It is matched with the Motherboard Disassemble Platform Main Unit - SS-T12A

Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - CPU

Specifications

● Model: T12A - CPU

● motherboard heating groove size: 126*72*18 mm (L*W*H)

● Net weight: 289 g

● Temperature: 100-280℃

Features

● Accurate temperature control and temperature adjustable.

● Offers heat evenly to protect the motherboard from damage.

● High purity copper is used as a film to ensure uniform heat transfer and heat.

After-Sale Service

Please feel free to contact us for any problems at any time: sales@youkingtech.com

Product Message
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