Motherboard Disassemble Platform Heating Groove For Mobile

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Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - CPU

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MOQ:: 1PCS

Payment:: TT/Money Gram/WU/Paypal

Place of Origin:: ShenZhen

Brand;: YOUKING

Delivery Time:: 1-3 Days

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Product Description

The motherboard disassemble platform heating groove for mobile phone - T12A - CPU including heating area, Silicone insulation, High purity copper film. It is matched with the Motherboard Disassemble Platform Main Unit - SS-T12A

Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - CPU

Specifications

● Model: T12A - CPU

● motherboard heating groove size: 126*72*18 mm (L*W*H)

● Net weight: 289 g

● Temperature: 100-280℃

Features

● Accurate temperature control and temperature adjustable.

● Offers heat evenly to protect the motherboard from damage.

● High purity copper is used as a film to ensure uniform heat transfer and heat.

After-Sale Service

Please feel free to contact us for any problems at any time: sales@youkingtech.com

Products

Phone Parts
Tablet Parts
LCD Glass Refurbishment

Quick Links

ShenZhen Office:

Unit 418,Tongjian Building,Shennan Middle Road

Futian, Shenzhen, China, 518100
Tel: (86)755-8860-6848 Fax: (86)755-8860-6848

HK Office:

7th Floor, 42 Hung To Road, Kwun Tong, Hong Kong.
Tel: (852)-6952-6879 Fax: (852)-6952-6879

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Soldering Equipment/Tools

Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - CPU