China Top 10 Phone Screen Factory 

Soldering Equipment/Tools

Home  > Products  > Mobile Repair Tools  > Soldering Equipment/Tools  > 

Motherboard Disassemble Platform Heating Groove For iPhone XXSXS Max - T12A - X3

这里可以自定义设置
Motherboard Disassemble Platform Heating Groove For iPhone XXSXS Max - T12A - X3
B站不支持收货地址
B站不支持库存规格
MOQ:
1PCS
Payment:
TT/Money Gram/WU/Paypal
Place of Origin:
ShenZhen
Brand;
YOUKING
Delivery Time:
1-3 Days
参数暂无数据
多属性暂无数据
B站不支持优惠卷

Add success, do you want to check your shopping cart?

暂无分享
B站不支持产品保障
该产品后台详情无内容

Product Description

The motherboard disassembles platform heating groove for iPhone X/XS/XS Max - T12A - X3 is suitable for iPhone X/XS/XS Mas motherboard repair heating disassembly, CPU and other components heating degumming. It is matched with the Motherboard Disassemble Platform Main Unit - SS-T12A.

Motherboard Disassemble Platform Heating Groove For iPhone XXSXS Max - T12A - X3

Specifications

● Model: T12A - X3

● Motherboard heating groove size: 126*72*18mm (L*W*H)

● Temperature: 100-280℃

Features

● The motherboard disassembles platform heating groove including the heating area for iPhone X/XS/XS Max, CPU glue removal area.

● The motherboard disassembles platform heating groove for iPhone X/XS/XS Max is only heating the middle column, without heating the CPU.

● Silicone insulation, high-temperature resistance, lowering the temperature of the bottom contact surface.

● High-purify copper is used as the contact surface to ensure uniform heat transfer and heat.

After-Sale Service

Please feel free to contact us for any problems at any time: sales@youkingtech.com

Product Message
社媒暂无评论
Chat Online
Chat Online
Chat Online inputting...
Sign in with: