Specifications

● Product Model: XG-50

● Alloy: Sn63/Pb37

● Microns: 20-38 um

● Gross Weight: 35 g

● Storage conditions: 0-10℃

Feature

● High-performance Non-Clean, easy to weld, bright and full of welding spot, no such phenomenon as false welding or false welding.

● The residue is colorless and transparent. It does not affect the monitoring, cleaning and cleaning performance.

● Good moisturizing and dry resistance. Under normal temperature, the shelf life is longer, which is suitable for mobile phone maintenance, computer

digital maintenance industry, high precision circuit board SMT welding, BGA process welding, etc.